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GaN-on-Si Quasi-Vertical p-n Diode With Junction Termination Extension Based on Hydrogen Plasma Treatment and Diffusion
被引:4
|作者:
Liu, Xuan
[1
]
Wang, Maojun
[2
,3
]
Wei, Jin
[2
,3
]
Wen, Cheng P.
[2
,3
]
Xie, Bing
[2
,3
]
Hao, Yilong
[2
,3
]
Yang, Xuelin
[1
]
Shen, Bo
[1
]
机构:
[1] Peking Univ, Sch Phys, Beijing 100871, Peoples R China
[2] Peking Univ, Sch Integrated Circuits, Beijing 100871, Peoples R China
[3] Beijing Adv Innovat Ctr Integrated Circuits, Beijing 100871, Peoples R China
关键词:
Annealing;
Hydrogen;
Plasmas;
Gallium nitride;
Anodes;
Junctions;
Schottky diodes;
Breakdown voltage (BV);
diffusion;
gallium nitride (GaN);
GaN-on-Si;
hydrogen;
junction termination extension (JTE);
p-n diodes;
HIGH-VOLTAGE;
FABRICATION;
SCHOTTKY;
DEVICES;
DESIGN;
DRIFT;
D O I:
10.1109/TED.2023.3247366
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
Utilizing hydrogen plasma treatment and con-trolled diffusion, a junction termination extension (JTE) structure for vertical gallium nitride (GaN) p-n diode with gradient hole density (GHD) is spontaneously formed based on the selective area partial passivation of Mg acceptors with hydrogen. The reverse bias for the quasi-vertical GaN-on-Si p-n diodes to reach a leakage current of 1 A/cm(2) was boosted from 631 to 1100 V. In addition, the fabricated diode possessed a superior rectifying behavior with an ON/OFF-current ratio of 10(12), a specific differential ON-resistance of 0.75 m omega middot cm(2).
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页码:1636 / 1640
页数:5
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