Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications

In the present paper, we report polymer composites based on phenolic resin filled with hexagonal boron nitride; hot compression molding coupled with solution-based mixing were used to manufacture the composites. The paper presents experimental results on the physical and physicochemical properties of the obtained composites: thermal stability in air and argon, dielectric constant and dielectric loss tangent, active electrical resistance, thermal conductivity (mean and anisotropy), and mechanical strength. It is shown that the proposed technique of composite manufacturing, including the application of high-process pressures, makes it possible to obtain materials with high anisotropy of thermal conductivity, extremely high-filler content, and excellent dielectric properties, all of which are very important for prospective highly efficient lightweight heatsink elements for electronic devices. Experimental values of thermal conductivity and dielectric constant were analyzed using known mathematical models. Experimental values for thermal conductivities (up to 18.5 W & BULL;m(-1)& BULL;K-1) of composites at filler loadings of 65-85 vol.% are significantly higher than published data for bulk boron nitride/polymer composites.