Investigation of a Surface Layer Formed on Silica Glass as a Result of Mechanical-Chemical and Ionic Polishing

被引:0
|
作者
Zolotarev, V. M. [1 ]
机构
[1] St Petersburg Natl Univ Informat Technol Mech & O, St Petersburg 197101, Russia
关键词
surface layer; silica glass; formation mechanism; mechanical-chemical and ionic polishing methods; OPTICAL-CONSTANTS; REFLECTION-SPECTROSCOPY; EXTREME-ULTRAVIOLET;
D O I
10.1134/S0030400X22120050
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Optical parameters of a surface layer formed on silica glass in the process of polishing are studied. It is shown that the mechanisms of surface layer formation by mechanical-chemical and ionic polishing have much in common. In both cases, the appearance of a surface layer with a refractive index higher than that of the bulk glass is related to stretching and breaking of Si-O-Si bridging bonds due to hydrolysis during glass polishing. The hydrolysis of Si-O-Si bonds occurs with formation of Si-O and Si-OH groups, which leads to an increase in the refractive index of the surface layer.
引用
收藏
页码:573 / 584
页数:12
相关论文
共 50 条
  • [21] Investigation on the controllable growth of monodisperse silica colloid abrasives for the chemical mechanical polishing application
    Hu, XiaoKai
    Song, Zhitang
    Wang, Haibo
    Liu, Weili
    Zhang, Zefang
    MICROELECTRONIC ENGINEERING, 2010, 87 (09) : 1751 - 1755
  • [22] Enhancement in Surface Finish by Modification of Basic Colloidal Silica with Silane in Chemical Mechanical Polishing
    Sivanandini, M.
    Dhami, Mandeep Kaur
    Dhami, Sukhdeep S.
    Pabla, B. S.
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2014, 3 (10) : P324 - P329
  • [23] NEAR-SURFACE MODIFICATION OF SILICA STRUCTURE INDUCED BY CHEMICAL-MECHANICAL POLISHING
    TROGOLO, JA
    RAJAN, K
    JOURNAL OF MATERIALS SCIENCE, 1994, 29 (17) : 4554 - 4558
  • [24] The effects of nodular colloidal silica on chemical mechanical polishing
    Haba, S
    Hong, G
    Morioka, Y
    Kobuchi, Y
    Katoda, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2003, 42 (08): : 4992 - 4997
  • [25] Chemical Mechanical Polishing of Gallium Nitride with Colloidal Silica
    Aida, Hideo
    Takeda, Hidetoshi
    Koyama, Koji
    Katakura, Haruji
    Sunakawa, Kazuhiko
    Doi, Toshiro
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2011, 158 (12) : H1206 - H1212
  • [26] Investigation on S-136 steel surface planarization by chemical mechanical polishing
    Zhang, Dongbo
    Liu, Juanbo
    Chen, Yunbo
    Wang, Miaohui
    Ge, Xueyuan
    MICROELECTRONIC ENGINEERING, 2015, 134 : 47 - 53
  • [27] Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)
    Yang, Ji Chul
    Oh, Dong Won
    Kim, Ho Joong
    Kim, Taesung
    JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (03) : 338 - 346
  • [28] The Effects of Nodular Colloidal Silica on Chemical Mechanical Polishing
    Haba, S., 1600, Japan Society of Applied Physics (42):
  • [29] Chemical mechanical polishing of copper using silica slurry
    Kondo, S
    Sakuma, N
    Homma, Y
    Ohashi, N
    PROCEEDINGS OF THE SYMPOSIA ON ELECTROCHEMICAL PROCESSING IN ULSI FABRICATION I AND INTERCONNECT AND CONTACT METALLIZATION: MATERIALS, PROCESSES, AND RELIABILITY, 1999, 98 (06): : 195 - 205
  • [30] Chemical–mechanical polishing of copper and tantalum with silica abrasives
    Y. Li
    M. Hariharaputhiran
    S. V. Babu
    Journal of Materials Research, 2001, 16 : 1066 - 1073