Self-Heating Influence on Hot Carrier Degradation Reliability of GAA FET by 3D KMC

被引:1
|
作者
Zhao, Songhan [1 ,2 ]
Zhao, Pan [1 ,2 ]
He, Yandong [1 ,2 ]
Du, Gang [1 ,2 ]
机构
[1] Peking Univ, Sch Integrated Circuits, Beijing 100871, Peoples R China
[2] Beijing Adv Innovat Ctr Integrated Circuits, Beijing, Peoples R China
关键词
self-heating; hot carrier degradation; threshold voltage degradation; temperature driving;
D O I
10.23919/SISPAD57422.2023.10319478
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The self-heating coupling of the hot carrier degradation effect is studied in detail. The results show that self-heating has a strong activation impact on hot carrier degradation. By simulating the influence of various temperature driving forces on reliability assessment, the necessity of using temperature gradient driving forces in the evaluation and prediction process is demonstrated. The temperature gradient inside the channel causes the trapped defects to concentrate toward the drain side. The threshold voltage degradation of each channel is separated from the multi-stack GAA device, which indicates that the reliability degradation of the intermediate channel is evidently different from the overall threshold voltage drift due to severe thermal effects.
引用
收藏
页码:101 / 104
页数:4
相关论文
共 50 条
  • [21] An improved accelerated degradation model for LED reliability assessment with self-heating impacts
    Truong, Minh-Tuan
    Do, Phuc
    Mendizabal, Laurent
    Iung, Benoit
    MICROELECTRONICS RELIABILITY, 2022, 128
  • [22] Origin of Heating Inside 3D FINFET and GAA Structures
    B. C. Joshi
    Alok P. S. Chauhan
    Navneet K. Sharma
    Dinesh Tripathi
    Silicon, 2022, 14 : 12909 - 12917
  • [23] Origin of Heating Inside 3D FINFET and GAA Structures
    Joshi, B. C.
    Chauhan, Alok P. S.
    Sharma, Navneet K.
    Tripathi, Dinesh
    SILICON, 2022, 14 (18) : 12909 - 12917
  • [24] Understanding and Modeling Opposite Impacts of Self-Heating on Hot-Carrier Degradation in n- and p-channel Transistors
    Tyaginov, Stanislav
    Makarov, Alexander
    El-Sayed, Al-Moatasem Bellah
    Chasin, Adrian
    Bury, Erik
    Jech, Markus
    Vandemaele, Michiel
    Grill, Alexander
    De Keersgieter, An
    Vexler, Mikhail
    Eneman, Geert
    Kaczer, Ben
    2022 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2022,
  • [25] Understanding and Modeling Opposite Impacts of Self-Heating on Hot-Carrier Degradation in n- and p-Channel Transistors
    Tyaginov, Stanislav
    Makarov, Alexander
    El-Sayed, Al-Moatasem Bellah
    Chasin, Adrian
    Bury, Erik
    Jech, Markus
    Vandemaele, Michiel
    Grill, Alexander
    De Keersgieter, An
    Vexler, Mikhail
    Eneman, Geert
    Kaczer, Ben
    2022 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2022,
  • [26] Performance & Reliability of 3D Architectures (&UPI;fet, Finfet, Ωfet)
    Laurent, A.
    Garros, X.
    Barraud, S.
    Pelloux-Prayer, J.
    Casse, M.
    Gaillard, F.
    Federspiel, X.
    Roy, D.
    Vincent, E.
    Ghibaudo, G.
    2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2018,
  • [27] Self-heating and Process-Induced Threshold Voltage Aware Reliability and Aging Analysis of Forksheet FET
    Rathore, Sunil
    Bagga, Navjeet
    Dasgupta, S.
    2024 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS 2024, 2024,
  • [28] Trap and self-heating effect based reliability analysis to reveal early aging effect in nanosheet FET
    Rathore, Sunil
    Jaisawal, Rajeewa Kumar
    Kondekar, P. N.
    Bagga, Navjeet
    SOLID-STATE ELECTRONICS, 2023, 200
  • [29] The Influence of Self Heating on the Measurement of Hot Carrier Degradation in High Voltage n-channel LDMOS
    Hao, Jifa
    Pelletier, Mark
    Murphy, Robert
    McGowan, Brian
    Kopley, Thomas E.
    2017 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2017,
  • [30] A novel degradation model for LED reliability assessment with accelerated stress and self-heating consideration
    Minh-Tuan Truong
    Mendizabal, Laurent
    Phuc Do
    Iung, Benoit
    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 2258 - 2265