ON THE EFFECT OF OXYGEN ON PLASMA CHEMICAL KINETICS IN CF4

被引:0
|
作者
Efremov, A. M. [1 ]
Bashmakova, D. E. [1 ]
Kwon, K. -H. [2 ]
机构
[1] Ivanovo State Univ Chem & Technol, Sheremetevskiy Ave 7, Ivanovo 153000, Russia
[2] Korea Univ, 208 Seochang Dong, Chochiwon 339800, South Korea
关键词
CF4; C4F8; O-2; plasma; parameters; active species; ionization; dissociation; etching; polymerization; ACTIVE SPECIES KINETICS; SILICON-NITRIDE; PARAMETERS; MODEL; MECHANISM;
D O I
10.6060/ivkkt.20246701.6721
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
In this work, we performed the comparative study of electro-physical plasma parameters, densities of active species and fluorine atom kinetics in CF4 + O-2 and C4F8 + O-2 gas mixtures with variable initial compositions at constant gas pressure and input power. The combination of plasma diagnostics by Langmuir probes and plasma modeling confirmed known features of plasma properties in individual fluorocarbon gases as well as allowed one to figure out key chemical processes determining plasma parameters in the presence of oxygen. It was shown that an increase in O-2 content with a proportional decrease in the fraction of any fluorocarbon component a) causes relatively weak changes in electrons-and ions-related plasma parameters; b) results in more drastic (compared with the dilution effect) decrease in densities of fluorocarbon radicals due to their oxidation into CFxO, FO and COx compounds; and c) sufficiently influences both formation and decay kinetics of fluorine atoms. The non-monotonic (with a maximum at similar to 40-50% O-2) change in the F atom density in the CF4 + O-2 plasma repeats behavior of their formation rate after the contribution of processes involving CFxO u FO species. The monotonic increase (with a constancy region up to similar to 40-50% O-2) in the F atom density in the C4F8 + O-2 plasma contradicts with the change in their formation rate, but results from decreasing decay frequency in gas-phase atom-molecular processes. The predictive analysis of heterogeneous process kinetics was carried out using model yielded data on fluxes of plasma active species. It was found that a) the addition of oxygen always lowers the plasma polymerizing ability; and b) the C4F8 + O-2 plasma keeps the higher polymerizing ability at any feed gas composition.
引用
收藏
页码:51 / 59
页数:9
相关论文
共 50 条
  • [21] CF4 decomposition by thermal plasma processing
    Jong-Woo Sun
    Dong-Wha Park
    Korean Journal of Chemical Engineering, 2003, 20 : 476 - 481
  • [22] Parameters and Composition of Plasma in a CF4 + H2 + Ar Mixture: Effect of CF4/H2 Ratio
    Miakonkikh A.V.
    Kuzmenko V.O.
    Efremov A.M.
    Rudenko K.V.
    Russian Microelectronics, 2024, 53 (01) : 70 - 78
  • [23] Impact of CF4 plasma treatment on GaN
    Chu, Rongming
    Suh, Chang Soo
    Wong, Man Hoi
    Fichtenbaum, Nicholas
    Brown, David
    McCarthy, Lee
    Keller, Stacia
    Wu, Feng
    Speck, James S.
    Mishra, Umesh K.
    IEEE ELECTRON DEVICE LETTERS, 2007, 28 (09) : 781 - 783
  • [24] FLUORINATION OF FULLERENE FILM BY CF4 PLASMA
    MIENO, T
    SAKURAI, A
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1995, 34 (4A): : L458 - L461
  • [25] MECHANISM OF SILICON ETCHING BY A CF4 PLASMA
    MAUER, JL
    LOGAN, JS
    ZIELINSKI, LB
    SCHWARTZ, GC
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (05): : 1734 - 1738
  • [26] Drastic change in CF2 and CF3 kinetics induced by hydrogen addition into CF4 etching plasma
    Hikosaka, Yukinobu
    Toyoda, Hirotaka
    Sugai, Hideo
    Japanese Journal of Applied Physics, Part 2: Letters, 1993, 32 (5 A):
  • [27] PLASMA CHEMICAL ASPECTS OF MAGNETRON ION ETCHING WITH CF4/O-2
    BRIGHT, AA
    KAUSHIK, S
    OEHRLEIN, GS
    JOURNAL OF APPLIED PHYSICS, 1987, 62 (06) : 2518 - 2522
  • [28] LOADING EFFECT AND TEMPERATURE-DEPENDENCE OF ETCH RATE IN CF4 PLASMA
    ENOMOTO, T
    DENDA, M
    YASUOKA, A
    NAKATA, H
    JAPANESE JOURNAL OF APPLIED PHYSICS, 1979, 18 (01) : 155 - 163
  • [29] Kinetic analysis of the chemical processes in the decomposition of gaseous dielectrics by a non-equilibrium plasma -: Part 1:: CF4 and CF4/O2.
    Bauerfeldt, GF
    Arbilla, G
    JOURNAL OF THE BRAZILIAN CHEMICAL SOCIETY, 2000, 11 (02) : 121 - 128
  • [30] CF4 decomposition using inductively coupled plasma:: Effect of power frequency
    Kuroki, T
    Mine, J
    Okubo, M
    Yamamoto, T
    Saeki, N
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2005, 41 (01) : 215 - 220