A SIMPLE PROCESS FOR THE FABRICATION OF PARALLEL-PLATE ELECTROSTATIC MEMS RESONATORS BY GOLD THERMOCOMPRESSION BONDING

被引：1

作者：

Juarez, Dolores Manrique ^{[1
]}

Mathieu, Fabrice ^{[1
]}

Libaude, Guillaume ^{[1
]}

Bourrier, David ^{[1
]}

Charlot, Samuel ^{[1
]}

Mazenq, Laurent ^{[1
]}

Conedera, Veronique ^{[1
]}

Salvagnac, Ludovic ^{[1
]}

Dufour, Isabelle ^{[2
]}

Nicu, Liviu ^{[1
]}

Leichle, Thierry ^{[1
,3
]}

机构：

[1] LAAS CNRS, Toulouse, France

[2] Univ Bordeaux, Lab IMS, UMR 5218, CNRS, Talence, France

[3] Georgia Tech, Sch Elect & Comp Engn, CNRS, Int Res Lab, Atlanta, GA USA

来源：

2023 IEEE 36TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMS | 2023年

关键词：

Micromechanical device; Cantilever; Parallel-plate capacitor; Resonant frequency; Q-factor; Packaging; Thermocompression;

D O I：

10.1109/MEMS49605.2023.10052563

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The present work introduces a simple and quick process for the fabrication of flexural MEMS resonators with electrostatic actuation and capacitive detection. Gold thermocompression is used to anchor the free-standing structure, to provide electrical connections and to seal the chip to protect the structure to be released during wet etching, in a single step. The additional advantage of this process is the ability to simply adjust the gap of the parallel-plate capacitor through the thickness of electroplated gold. Squeeze damping is reduced by fabricating devices with increasing gaps.

引用

页码：643 / 646

页数：4

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