Thin-Film Memristors and Memcapacitors for 3D Integration of Neuromorphic Systems

被引：0

作者：

Kimura, Mutsumi ^{[1
]}

Shiomi, Shu ^{[1
]}

Komai, Norito ^{[1
]}

Iwagi, Etsuko ^{[1
]}

Yokoyama, Tomoharu ^{[1
]}

Ishisaki, Yuma ^{[1
]}

Matsuda, Tokiyoshi ^{[2
]}

Kawanishi, Hidenori ^{[1
]}

机构：

[1] Ryukoku Univ, Dept Elect & Informat, Otsu, Shiga, Japan

[2] Kindai Univ, Fac Sci & Engn, Higashiosaka, Osaka, Japan

来源：

2023 IEEE 36TH INTERNATIONAL SYSTEM-ON-CHIP CONFERENCE, SOCC | 2023年

关键词：

thin film; memristor; memcapacitor; 3D integration; neuromorphic system; OXIDE;

D O I：

10.1109/SOCC58585.2023.10257032

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

Thin-film memristors and memcapacitors have been developed for 3D integration of neuromorphic systems. These devices have extremely simple structures, can be stacked by deposition methods such as sputtering and mist CVD methods, and therefore are suitable for astronomical large-scale integration. Moreover, nonvolatile plasticity of the conductance and capacitance characteristics is obtained according to the semiconductor physics. Finally, they are actually implemented in neuromorphic systems, and elementary functions of artificial intelligence are confirmed, as well as future possibility of ultra-low power consumption.

引用

页码：208 / 213

页数：6

共 50 条

[1] Inkjet-printed niobium tungsten oxide thin-film memristors for neuromorphic computing
Zhu, Guanyao
Chen, Xiaomei
Ma, Jingchen
Dai, Guoshu
Liu, Zhen
MATERIALS TODAY COMMUNICATIONS, 2025, 44
[2] 3D Neuromorphic Hardware with Single Thin-Film Transistor Synapses Over Single Thin-Body Transistor Neurons by Monolithic Vertical Integration
Han, Joon-Kyu
Lee, Jung-Woo
Kim, Yeeun
Kim, Young Bin
Yun, Seong-Yun
Lee, Sang-Won
Yu, Ji-Man
Lee, Keon Jae
Myung, Hyun
Choi, Yang-Kyu
ADVANCED SCIENCE, 2023, 10 (30)
[3] Conformal Deposition For 3D Thin-Film Batteries
Vereecken, P. M.
Huyghebaert, C.
ATOMIC LAYER DEPOSITION APPLICATIONS 9, 2013, 58 (10): : 111 - 118
[4] Design Challenges and Methodologies in 3D Integration for Neuromorphic Computing Systems
Ehsan, M. Amimul
An, Hongyu
Zhou, Zhen
Yi, Yang
PROCEEDINGS OF THE SEVENTEENTH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN ISQED 2016, 2016, : 24 - 28
[5] 3D nanoporous thin-film electrodes for energy storage
Yang, Yang
Tour, James M.
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2014, 247
[6] 3D discrete dislocation models of thin-film plasticity
Hartmaier, A
Fivel, MC
Canova, GR
Gumbsch, P
THIN-FILMS - STRESSES AND MECHANICAL PROPERTIES VII, 1998, 505 : 539 - 544
[7] Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules
Posada, G.
Carchon, G.
Nauwelaers, B.
De Raedt, W.
58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 2060 - +
[8] Flexible Oxide Thin Film Transistors, Memristors, and Their Integration
Panca, Alin
Panidi, Julianna
Faber, Hendrik
Stathopoulos, Spyros
Anthopoulos, Thomas D.
Prodromakis, Themis
ADVANCED FUNCTIONAL MATERIALS, 2023, 33 (20)
[9] 3D Visualization of the Effect of Plasma Temperature on Thin-Film Morphology
Abdelkader, Bouazza
BULLETIN OF THE LEBEDEV PHYSICS INSTITUTE, 2023, 50 (01) : 7 - 13
[10] Advances in 3D Thin-Film Li-Ion Batteries
Moitzheim, Sebastien
Put, Brecht
Vereecken, Philippe M.
ADVANCED MATERIALS INTERFACES, 2019, 6 (15)

← 1 2 3 4 5 →