In Situ Study the Grooving Effect Induced by Ag Particles on Rapid Growth of Cu6Sn5 Grain at Sn-xAg/Cu Soldering Interface during the Heat Preservation Stage

被引：0
|
作者：
Guo, Bingfeng [1 ]
Ma, Haitao [2 ]
Kunwar, Anil [3 ]
Wang, Rongzhi [1 ]
Zheng, Han [1 ]
机构：
[1] Yichun Univ, Phys Sci & Engn Technol Coll, Yichun 336000, Peoples R China
[2] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China
[3] Silesian Tech Univ, Fac Mech Engn, Konarskiego 18A, PL-44100 Gliwice, Poland
来源：
METALS | 2023年 / 13卷 / 08期
关键词：
reflow soldering; synchrotron radiation; intermetallic compounds; grooves; growth kinetics; LIQUID SN; INTERMETALLIC COMPOUNDS; CU; AG3SN; BEHAVIOR;
D O I：
10.3390/met13081445
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Synchrotron radiation X-ray imaging technique was applied for in situ observation of Cu6Sn5 intermetallic compounds (IMC) growth in Sn/Cu and Sn-3.5Ag/Cu joints under isothermal temperature conditions of 250/300/350 degrees C and time duration of 1.5 h. The IMC in Sn-Ag solder was characterized by the formation of grooves during the interfacial reaction, and this can be attributed to the Ag content. Kinetically, the growth rate constants for the height of Cu6Sn5 were observed to increase with temperatures and the presence of Ag in solder. As compared to pure Sn solders, the Sn-3.5Ag solders were observed with interfacial IMC of greater height, smaller base width, and lowered aspect ratio.
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页数：15
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