Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2 solder joints

被引：0
|
作者：
Tang, Y. [1 ]
Luo, S.M. [1 ]
Wang, K.Q. [1 ]
Li, G.Y. [2 ]
机构：
[1] College of Automation, Zhongkai University of Agriculture and Engineering, Guangzhou,510225, China
[2] School of Electronic and Information Engineering, South China University of Technology, Guangzhou,510641, China
来源：
Journal of Alloys and Compounds | 2016年 / 684卷
关键词：
Titanium dioxide;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：299 / 309
相关论文
共 50 条
  • [1] Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2 solder joints
    Tang, Y.
    Luo, S. M.
    Wang, K. Q.
    Li, G. Y.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 684 : 299 - 309
  • [2] Influence of nano-TiO2 dopant on Cu6Sn5 IMC grain ripening growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints
    Tang, Yu
    Luo, Shaoming
    Wang, Keqiang
    Li, Guoyuan
    Hanjie Xuebao/Transactions of the China Welding Institution, 2015, 36 (12): : 56 - 60
  • [3] Ripening Growth Kinetics of Cu6Sn5 Grains in Sn-3.0Ag-0.5Cu-xTiO2/Cu Solder Joints During the Reflow Process
    Tang, Y.
    Luo, S. M.
    Li, G. Y.
    Yang, Z.
    Hou, C. J.
    JOURNAL OF ELECTRONIC PACKAGING, 2018, 140 (01)
  • [4] Effect of Cu6Sn5 nanoparticles addition on properties of Sn3.0Ag0.5Cu solder joints
    Lv, Ziwen
    Wang, Jintao
    Wang, Fengyi
    Zhang, Weiwei
    Wang, Jianqiang
    Hang, Chunjin
    Chen, Hongtao
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 34 (08)
  • [5] Effect of Cu6Sn5 nanoparticles addition on properties of Sn3.0Ag0.5Cu solder joints
    Ziwen Lv
    Jintao Wang
    Fengyi Wang
    Weiwei Zhang
    Jianqiang Wang
    Chunjin Hang
    Hongtao Chen
    Journal of Materials Science: Materials in Electronics, 2023, 34
  • [6] Diffusion wave model and growth kinetics of interfacial intermetallic compounds in Sn-3.0Ag-0.5Cu-xTiO2 solder joints
    Tang, Y.
    Li, G. Y.
    Luo, S. M.
    Wang, K. Q.
    Zhou, B.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 26 (05) : 3196 - 3205
  • [7] Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process
    Tang, Y.
    Li, G. Y.
    Pan, Y. C.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2013, 554 : 195 - 203
  • [8] Effect of the addition of Cu6Sn5 nanoparticles on the growth of intermetallic compounds at the interfaces of Sn3.0Ag0.5Cu solder joints
    Lv, Ziwen
    Wang, Jintao
    Wang, Fengyi
    Wang, Jianqiang
    Li, Fuquan
    Chen, Hongtao
    MATERIALS LETTERS, 2024, 355
  • [9] Morphological Evolution and Growth Kinetics of Interfacial Cu6Sn5 and Cu3Sn Layers in Low-Ag Sn-0.3Ag-0.7Cu-xMn/Cu Solder Joints During Isothermal Ageing
    Y. Tang
    S.M. Luo
    Z.H. Li
    C.J. Hou
    G.Y. Li
    Journal of Electronic Materials, 2018, 47 : 5913 - 5929
  • [10] Morphological Evolution and Growth Kinetics of Interfacial Cu6Sn5 and Cu3Sn Layers in Low-Ag Sn-0.3Ag-0.7Cu-xMn/Cu Solder Joints During Isothermal Ageing
    Tang, Y.
    Luo, S. M.
    Li, Z. H.
    Hou, C. J.
    Li, G. Y.
    JOURNAL OF ELECTRONIC MATERIALS, 2018, 47 (10) : 5913 - 5929
12345