Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2 solder joints

被引：0
|
作者：
Tang, Y. [1 ]
Luo, S.M. [1 ]
Wang, K.Q. [1 ]
Li, G.Y. [2 ]
机构：
[1] College of Automation, Zhongkai University of Agriculture and Engineering, Guangzhou,510225, China
[2] School of Electronic and Information Engineering, South China University of Technology, Guangzhou,510641, China
来源：
Journal of Alloys and Compounds | 2016年 / 684卷
关键词：
Titanium dioxide;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：299 / 309
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