Global Floorplanning via Semidefinite Programming

被引:0
|
作者
Li, Wei [1 ]
Wang, Fangzhou [2 ]
Moura, Jose M. F. [1 ]
Blanton, R. D. [1 ]
机构
[1] Carnegie Mellon Univ, Elect & Comp Engn Dept, Pittsburgh, PA 15213 USA
[2] Chinese Univ Hong Kong, Dept Comp Sci & Engn, Hong Kong, Peoples R China
来源
2023 60TH ACM/IEEE DESIGN AUTOMATION CONFERENCE, DAC | 2023年
关键词
REPRESENTATION; ALGORITHM; SEQUENCE; PACKING;
D O I
10.1109/DAC56929.2023.10247967
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
A major task in chip design involves identifying the location and shape of each major design block/module in the layout footprint. This is commonly known as floorplanning. The first step of this task is known as global floorplanning and involves identifying a location for each module that minimizes wire length and leaves sufficient area for each module. Existing global floorplanning methods either have a non-convex problem formulation, or have trivial global solutions with no guarantee on the quality of the result. Here, we model the global floorplanning as a Semi-Definite Programming (SDP) problem with a rank constraint. We replace the rank constraint with a direction matrix and convexify the problem, whose solution is shown to be a global optimum if an appropriate direction matrix is chosen. To calculate the direction matrix, a convex iteration algorithm is used where the problem is decomposed into two SDP sub-problems. Furthermore, we introduce a series of techniques that enhance the flexibility, accuracy, and efficiency of our algorithm. Design experiments demonstrate that our proposed method reduces the average wirelength up to 20% for different benchmarks and outline aspect ratios.
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页数:6
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