Characterization of positive bias temperature instability of NMOSFET with high-k/metal gate last process

被引:0
|
作者
任尚清 [1 ]
杨红 [1 ]
唐波 [1 ]
徐昊 [1 ]
罗维春 [1 ]
唐兆云 [1 ]
徐烨锋 [1 ]
许静 [1 ]
王大海 [1 ]
李俊峰 [1 ]
闫江 [1 ]
赵超 [1 ]
陈大鹏 [1 ]
叶甜春 [1 ]
王文武 [1 ]
机构
[1] Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics,Chinese Academy of Sciences
基金
中国国家自然科学基金;
关键词
positive bias temperature instability(PBTI); high-k; metal gate;
D O I
暂无
中图分类号
TN386 [场效应器件];
学科分类号
摘要
Positive bias temperature instability(PBTI) characteristics and degradation mechanisms of NMOSFET with high-k/metal gate last process have been systematically investigated. The time evolution of threshold voltage shift during PBTI stress still follows a power law. However, the exponent n decreases from 0.26 to 0.16 linearly as the gate stress voltage increases from 0.6 to 1.2 V. There is no interface state generation during stress because of the negligible sub-threshold swing change. Moreover, the activation energy is 0.1 e V, which implies that electrons directly tunnel into high-k bulk and are trapped by pre-existing traps resulting into PBTI degradation. During recovery the threshold voltage shift is linear in lgt, and a mathematical model is proposed to express threshold voltage shift.
引用
收藏
页码:90 / 93
页数:4
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