共 50 条
- [21] Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding Journal of Materials Science: Materials in Electronics, 2009, 20 : 1144 - 1149
- [23] Investigation of Thermosonic Wire Bonding Resistance of Gold Wire Onto Copper Pad IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2010, 33 (01): : 65 - 70
- [26] Dynamics of Free Air Ball Formation in Thermosonic Wire Bonding IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (08): : 1389 - 1393
- [29] Study of interfacial phenomena affecting thermosonic wire bonding in microelectronics JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME, 2003, 125 (03): : 576 - 581