Temperature effect in thermosonic wire bonding

被引:0
|
作者
吴运新
隆志力
韩雷
钟掘
机构
[1] School of Electromechanical Engineering Cent ral South University Changsha 410083 China
[2] School of Electromechanical Engineering Cent ral South University Changsha 410083 China
基金
中国国家自然科学基金;
关键词
thermosonic wire bonding; filp chip bonding; bonding temperature; bonding strength; ultrasonic energy;
D O I
暂无
中图分类号
TN773 [变频器、混频器];
学科分类号
摘要
The temperature effect on bonding strength and ultrasonic transmission in a PZT transducer system was investigated. The results show that, the temperature change influences the material features of the bonding interface, such as elastic modulus, tensile strength of gold ball and Ag substrate, which results in different bonding strengths. Moreover, the temperature change also influences the impedance and dissipative ultrasonic energy in the PZT system. The current signal of PZT transducer was analyzed by join time-frequency analysis, which can reveal the current change in a bonding process more clearly and completely. The analysis shows that the bonding parameters influence mutually. These results can help build some criteria for parameter match and optimization in wire bonding processes.
引用
收藏
页码:618 / 622
页数:5
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