ALUMINUM WIRE FOR THERMOSONIC BALL BONDING IN SEMICONDUCTOR-DEVICES

被引：0
|
作者：
GEHMAN, BL
RITALA, KE
ERICKSON, LC
机构：
来源：
SOLID STATE TECHNOLOGY | 1983年 / 26卷 / 10期
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
10
引用
收藏
页码：151 / 158
页数：8
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