Temperature effect in thermosonic wire bonding

被引:0
|
作者
吴运新
隆志力
韩雷
钟掘
机构
[1] School of Electromechanical Engineering Cent ral South University Changsha 410083 China
[2] School of Electromechanical Engineering Cent ral South University Changsha 410083 China
基金
中国国家自然科学基金;
关键词
thermosonic wire bonding; filp chip bonding; bonding temperature; bonding strength; ultrasonic energy;
D O I
暂无
中图分类号
TN773 [变频器、混频器];
学科分类号
摘要
The temperature effect on bonding strength and ultrasonic transmission in a PZT transducer system was investigated. The results show that, the temperature change influences the material features of the bonding interface, such as elastic modulus, tensile strength of gold ball and Ag substrate, which results in different bonding strengths. Moreover, the temperature change also influences the impedance and dissipative ultrasonic energy in the PZT system. The current signal of PZT transducer was analyzed by join time-frequency analysis, which can reveal the current change in a bonding process more clearly and completely. The analysis shows that the bonding parameters influence mutually. These results can help build some criteria for parameter match and optimization in wire bonding processes.
引用
收藏
页码:618 / 622
页数:5
相关论文
共 50 条
  • [1] Temperature effect in thermosonic wire bonding
    Wu Yun-xin
    Long Zhi-li
    Han Lei
    Zhong Jue
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2006, 16 (03) : 618 - 622
  • [2] Effect of different temperature on strength of thermosonic bonding
    Long, Zhi-Li
    Han, Lei
    Wu, Yun-Xin
    Zhou, Hong-Quan
    Hanjie Xuebao/Transactions of the China Welding Institution, 2005, 26 (08): : 23 - 26
  • [3] Thermosonic Platinum Wire Bonding on Platinum
    Schulz, Katharina
    Ernst, Daniel
    Menzel, Siegfried
    Gemming, Thomas
    Eckert, Juergen
    Wolter, Klaus-Juergen
    PROCEEDINGS OF THE 2014 37TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) - ADVANCES IN ELECTRONIC SYSTEM INTEGRATION, 2014, : 124 - 128
  • [4] THERMOSONIC GOLD WIRE BONDING TO COPPER CONDUCTORS
    PITT, VA
    NEEDES, CRS
    SOLID STATE TECHNOLOGY, 1983, 26 (03) : 81 - 86
  • [5] THERMOSONIC GOLD WIRE BONDING TO COPPER CONDUCTORS
    PITT, VA
    NEEDES, CRS
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1982, 5 (04): : 435 - 440
  • [6] Cratering on thermosonic copper wire ball bonding
    Wei, TC
    Daud, AR
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2002, 11 (03) : 283 - 287
  • [7] Study of Ag-alloy wire in thermosonic wire bonding
    Wu, Jie
    Rockey, Tom
    Yauw, Oranna
    Shen, Liming
    Chylak, Bob
    PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 499 - 503
  • [8] Cratering on thermosonic copper wire ball bonding
    Tan Chee Wei
    Abdul Razak Daud
    Journal of Materials Engineering and Performance, 2002, 11 : 283 - 287
  • [9] Effect of Capillary Trace on Dynamic Loop Profile Evolution in Thermosonic Wire Bonding
    Wang, Fuliang
    Chen, Yun
    Han, Lei
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (09): : 1550 - 1557
  • [10] STUDY OF TEMPERATURE PARAMETER ON THE THERMOSONIC GOLD WIRE BONDING OF HIGH-SPEED CMOS
    HU, SJ
    LIM, GE
    LIM, TL
    FOONG, KP
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (04): : 855 - 858