Low temperature bonding of LD31 aluminum alloys by electric brush plating Ni and Cu coatings

被引:1
|
作者
赵振清
王春青
杜淼
机构
[1] Harbin Welding Institute
[2] Harbin Institute of Technology
[3] Microjoining Laboratory
[4] School of Material Science and Engineering
关键词
LD31 aluminum alloy; electric brush plating; coating; soldering;
D O I
暂无
中图分类号
TG174.4 [金属表面防护技术];
学科分类号
摘要
Soldering of LD31 aluminum alloys using Sn-Pb solder paste after electric brush plating Ni and Cu coatings was investigated. The technology of electric brush plating Ni and Cu was studied and plating solution was developed. The microstructure of the coatings, soldered joint and fracture face were analyzed using optic microscopy, SEM and EDX. The shear strength of soldered joint could reach as high as 26.83MPa. The results showed that reliable soldered joint could be obtained at 230℃, the adhesion of coatings and LD31 aluminum alloy substrate was high enough to bear the thermal process in the soldering.
引用
收藏
页码:24 / 28
页数:5
相关论文
共 50 条
  • [21] Structure and wear resistance at elevated temperature of auto brush-plating n-Al2O3/Ni composite coatings
    Zhang Bin
    Xu Binshi
    Dong Shiyun
    Wu Bin
    SURFACE ENGINEERING (ICSE 2007), 2008, 373-374 : 523 - 526
  • [22] LOW TEMPERATURE ELECTRICAL RESISTIVITY OF DILTUE SOLUTIONS OF FE IN CU-NI ALLOYS
    GARTNER, H
    ZRUDSKY, DR
    LEGVOLD, S
    SOLID STATE COMMUNICATIONS, 1970, 8 (11) : 913 - &
  • [23] Effect of Cu Addition on W-Ni-Fe Alloys Sintered at a Low Temperature
    Chuanbin WANG
    JournalofMaterialsScience&Technology, 2002, (03) : 234 - 236
  • [24] Effect of Cu addition on W-Ni-Fe alloys sintered at a low temperature
    Wang, CB
    Shen, Q
    Zhang, LM
    JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2002, 18 (03) : 234 - 236
  • [25] LOW TEMPERATURE ELECTRICAL RESISTIVITY AND MAGNETORESISTANCE OF DILUTE SOLUTIONS OF MN IN CU-NI ALLOYS
    HARVEY, AR
    LEGVOLD, S
    BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1971, 16 (03): : 413 - &
  • [26] THE STRUCTURE AND LOW-TEMPERATURE STRENGTH OF THE AGE HARDENED CU-NI-SN ALLOYS
    KRATOCHVIL, P
    MENCL, J
    PESICKA, J
    KOMNIK, SN
    ACTA METALLURGICA, 1984, 32 (09): : 1493 - 1497
  • [27] EFFECT OF LOW-TEMPERATURE ANNEALING ON THE PROPERTIES OF NI-P AMORPHOUS ALLOYS DEPOSITED VIA ELECTROLESS PLATING
    Zhao, Guanlin
    Zou, Yong
    Zhang, Hui
    Zou, Zengda
    ARCHIVES OF METALLURGY AND MATERIALS, 2015, 60 (02) : 865 - 869
  • [28] Low-temperature direct diffusion bonding of Zr702 alloys via electric current assistance
    Li, Huaxin
    Wang, Junjian
    Guo, Jiejie
    Wei, Lianfeng
    He, Yanming
    Yang, Jianguo
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2024, 38 (19) : 3636 - 3655
  • [29] Wetting and low temperature bonding of zirconia metallized with Sn0.3Ag0.7Cu-Ti alloys
    Bian, H.
    Fu, W.
    Lei, Y. Z.
    Song, X. G.
    Liu, D.
    Cao, J.
    Feng, J. C.
    CERAMICS INTERNATIONAL, 2018, 44 (10) : 11456 - 11465
  • [30] LOW-TEMPERATURE ELECTRICAL RESISTIVITY AND MAGNETORESISTANCE OF DILUTE SOLUTIONS OF FE IN CU-NI ALLOYS
    GARTNER, H
    HARVEY, AR
    ZRUDSKY, DR
    PETERSON, D
    LEGVOLD, S
    JOURNAL OF APPLIED PHYSICS, 1971, 42 (04) : 1549 - &