Supercritical CO2-based solvents in next generation microelectronics processing

被引:0
|
作者
Keith P.JOHNSTON [1 ]
机构
[1] Department of Chemical Engineering Center for Nano and Molecular Science and Technology University of Texas at Austin Austin TX 78712 USA
基金
中国国家自然科学基金;
关键词
supercritical carbon dioxide; low-k dielectrics cleaning; photoresist drying;
D O I
暂无
中图分类号
TN405 [制造工艺];
学科分类号
080903 ; 1401 ;
摘要
Large amount of chemicals and highly purified-water are needed in microelectronic manufacture. The ability of solutions to penetrate tiny spaces will become significantly more challenging as the feature size of semiconductor devices decreases to nanoscale dimensions and the functional complexity of integrated circuitries (ICs) ever increases. Supercritical fluids (SCFs) possess a unique combination of properties (no surface tension and gas-like viscosity) that can potentially be exploited for application in microelectronics manufacturing and processing in response to needs for material-compatible cleaning systems, small-dimension developing solvents, and low chemical-use processes. Recent microelec- tronics processes for cleaning and rinsing of patterned porous low-k dielectrics and drying of photo- resist in CO2-based solvents are the main focus of this review. Additional topics in supercritical fluid processing include spin coating of photoresists, development with nanoscale dimensions, metal deposition and silylation.
引用
收藏
页码:27 / 33
页数:7
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