System-level simulation of microbolometer and read-out integrated circuit

被引：0
|
作者：
CHEN Chao [1 ,2 ]
JIANG YaDong [1 ,2 ]
ZHANG Long [1 ,2 ]
ZHOU Yun [1 ,2 ]
ZHENG Xing [1 ,2 ]
机构：
[1] School of Optoelectronic Information, University of Electronic Science and Technology of China
[2] State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China
来源：
Science China Technological Sciences | 2015年 / 05期
基金：
中国国家自然科学基金;
关键词：
microbolometer; Finite Element Method(FEM); thermoelectric field-coupling; system-level simulation;
D O I：
暂无
中图分类号：
TN401 [理论];
学科分类号：
080903 ; 1401 ;
摘要：
A method for system-level simulation between microbolometer designing and Read-Out Integrated Circuit(ROIC) was studied. Three-dimensional(3D) structure modeling of the microbolometer was built. Thermal capacity, thermal conductivity and resistance of the model were obtained from thermoelectric coupling Finite Element Method(FEM) based on the model. An electrical equipment circuit of microbolometer which contains these three parameters was established. By using Verilog-AMS language, the electrical equipment circuit was described as a reduced-order macro-model. Then, the reduced-order macromodel was compiled in cadence to form IP unit of microbolometer, which could be used and identified in cadence. Systemlevel simulation between microbolometer and ROIC was accomplished. Key performances of the device, including input and output characteristics, were obtained in simulation and verified by experimental results.
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页码：907 / 915
页数：9
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