Study on the Differences of Electromigration Life betweeen BGA and QFP Solder Joints

被引：0
|
作者：
Zhang, Fei [1 ]
Chen, Shuai [1 ]
Liu, Zhidian [1 ]
机构：
[1] Xian Res Inst Nav Technol, Xian, Peoples R China
来源：
2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2022年
关键词：
Electromigration life; BGA solder joint; QFP solder joint;
D O I：
10.1109/ICEPT56209.2022.9872717
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, the different electromigration lives of BGA and QFP solder joints were studied under the average current density of 0.9x10(3)A/cm(2) at 125 degrees C. After EM 1171h, QFP solder joints first failed. From the appearance observation of the solder joints, a large amount of metal residue accumulation was observed outside the QFP solder joints, and no significant changes were observed outside the BGA solder joints. After the electromigration, the QFP solder joint structure changed from Cu/Cu6Sn5/solder/Cu6Sn5/Cu after reflow soldering into Cu/Cu3Sn/Cu6Sn5/Cu3Sn/Cu. Sn in the Sn63Pb37 solder in QFP solder joints were almost consumed, while Pb atoms were enriched outside the solder joints, and a large number of cracks formed at the interface near pin side in the solder joints. QFP solder joints failed earlier than BGA solder joints, which was because the solder in QFP solder joints was much lower than that in BGA solder joints, and then was consumed earlier than that in BGA solder joints.
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页数：3
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