Study on the Differences of Electromigration Life betweeen BGA and QFP Solder Joints

被引：0
|
作者：
Zhang, Fei [1 ]
Chen, Shuai [1 ]
Liu, Zhidian [1 ]
机构：
[1] Xian Res Inst Nav Technol, Xian, Peoples R China
来源：
2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2022年
关键词：
Electromigration life; BGA solder joint; QFP solder joint;
D O I：
10.1109/ICEPT56209.2022.9872717
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, the different electromigration lives of BGA and QFP solder joints were studied under the average current density of 0.9x10(3)A/cm(2) at 125 degrees C. After EM 1171h, QFP solder joints first failed. From the appearance observation of the solder joints, a large amount of metal residue accumulation was observed outside the QFP solder joints, and no significant changes were observed outside the BGA solder joints. After the electromigration, the QFP solder joint structure changed from Cu/Cu6Sn5/solder/Cu6Sn5/Cu after reflow soldering into Cu/Cu3Sn/Cu6Sn5/Cu3Sn/Cu. Sn in the Sn63Pb37 solder in QFP solder joints were almost consumed, while Pb atoms were enriched outside the solder joints, and a large number of cracks formed at the interface near pin side in the solder joints. QFP solder joints failed earlier than BGA solder joints, which was because the solder in QFP solder joints was much lower than that in BGA solder joints, and then was consumed earlier than that in BGA solder joints.
引用
收藏
页数：3
相关论文
共 50 条
  • [21] The Study on Electromigration of Solder Joints under Thermal Cycling Load
    Niu, Leyi
    Tian, Xiaodi
    Jia, Fei
    2021 22ND INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2021,
  • [22] Detecting Failure Precursors in BGA Solder Joints
    Jaai, Rubyca
    Pecht, Michael
    Cook, Jason
    ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM, 2009 PROCEEDINGS, 2009, : 100 - +
  • [23] An analysis case on the failure of BGA solder joints
    Li, Weiming
    Sun, Xiaowei
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 731 - 734
  • [24] How voids develop in BGA solder joints
    O'Hara, Wanda B.
    Lee, Ning-Cheng
    Surface mount technology, 1996, 10 (01):
  • [25] Flexure induced failure of BGA solder joints
    Lei, KS
    Llinas, J
    Gwaltney, M
    SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM, 1999, : 229 - 236
  • [26] Impact reliability study of BGA solder joints and dropping test method
    Yu, Q
    Kikuchi, H
    Watanabe, K
    Siratori, M
    Kakino, M
    Fujiwara, N
    ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, : 777 - 7821
  • [27] Pull testing of lead-free QFP solder joints
    Sundelin, JJ
    Nurmi, ST
    Lepistö, TK
    Ristolainen, EO
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1622 - 1626
  • [28] Reliability study on thermal cycling of QFP device solder joints based on morphological optimisation
    Liu, Kunpeng
    Zhang, Wei
    Qu, Chen
    Xiang, Gang
    Wang, Shang
    Tian, Yanhong
    2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
  • [29] Electromigration time to failure of SnAgCuNi solder joints
    Basaran, Cemal
    Li, Shidong
    Hopkins, Douglas C.
    Veychard, Damien
    JOURNAL OF APPLIED PHYSICS, 2009, 106 (01)
  • [30] Effect of electromigration on mechanical behavior of solder joints
    Ren, F
    Nah, JW
    Gan, H
    Suh, JO
    Tu, KN
    Xiong, BS
    Xu, LH
    Pang, J
    MATERIALS, TECHNOLOGY AND RELIABILITY OF ADVANCED INTERCONNECTS-2005, 2005, 863 : 369 - 373
12345