On-Chip Antennas for IC Reliability and Aging Monitoring

被引：0

作者：

Muha, Andrew ^{[1
]}

Vutukuru, Manoj Yasaswi ^{[1
]}

Gogi, Vamshi Kiran ^{[1
]}

Jha, Rashmi ^{[1
]}

机构：

[1] Univ Cincinnati, Elect & Comp Engn Dept, Cincinnati, OH 45221 USA

来源：

2024 IEEE 67TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, MWSCAS 2024 | 2024年

关键词：

on-chip antennas; electromigration; interconnects; integrated circuit reliability;

D O I：

10.1109/MWSCAS60917.2024.10658847

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

We propose the use of on-chip antennas for the continuous monitoring of integrated circuit aging. We focus on detecting electromigration of interconnects using near-field EM emissions by measuring the change in differential-mode coupling between the interconnects and on-chip antennas. Simulations are performed to determine the effect of electromigration on the near-field coupling, and the on-chip antennas are fabricated and annealed to determine their compatibility with the back end of line process.

引用

页码：1276 / 1280

页数：5

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