On-Chip Antennas for IC Reliability and Aging Monitoring

被引：0
|
作者：
Muha, Andrew [1 ]
Vutukuru, Manoj Yasaswi [1 ]
Gogi, Vamshi Kiran [1 ]
Jha, Rashmi [1 ]
机构：
[1] Univ Cincinnati, Elect & Comp Engn Dept, Cincinnati, OH 45221 USA
来源：
2024 IEEE 67TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, MWSCAS 2024 | 2024年
关键词：
on-chip antennas; electromigration; interconnects; integrated circuit reliability;
D O I：
10.1109/MWSCAS60917.2024.10658847
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
We propose the use of on-chip antennas for the continuous monitoring of integrated circuit aging. We focus on detecting electromigration of interconnects using near-field EM emissions by measuring the change in differential-mode coupling between the interconnects and on-chip antennas. Simulations are performed to determine the effect of electromigration on the near-field coupling, and the on-chip antennas are fabricated and annealed to determine their compatibility with the back end of line process.
引用
收藏
页码：1276 / 1280
页数：5
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