Packaged Tunable Single Mode III-V Laser Hybrid Integrated on a Silicon Photonic Integrated Chip using Photonic Wire Bonding

被引：0

作者：

Deenadayalan, Venkatesh ^{[1
]}

Thornton, Eric ^{[1
]}

Nelson, George T. ^{[2
]}

McGarvey, Peter ^{[2
]}

King, Jonathan D. ^{[2
]}

Patel, Jill ^{[2
]}

Bickford, Justin ^{[3
]}

Mitchell, Matthew ^{[4
]}

Chrostowski, Lukas ^{[4
,5
]}

Shekhar, Sudip ^{[5
,6
]}

Kemal, Juned N. ^{[7
]}

Skacel, Sebastian Tobias ^{[7
]}

Ciminelli, Mario ^{[1
]}

Preble, Stefan ^{[1
]}

机构：

[1] Rochester Inst Technol, Rochester, NY 14623 USA

[2] Res Fdn SUNY, Amer Inst Mfg Integrated Photon AIM Photon, Rochester, NY USA

[3] US Army, Res Lab, Adelphi, MD USA

[4] Dream Photon, Vancouver, BC, Canada

[5] Univ British Columbia, Vancouver, BC, Canada

[6] Dream Photon, Woodinville, WA USA

[7] Vanguard Automat, Karlsruhe, Germany

来源：

PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024 | 2024年

关键词：

Photonic Wire Bonding; Lasers; Integration; Tuning; Thermal;

D O I：

10.1109/ECTC51529.2024.00226

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Photonic wire bonding is a passive laser-PIC integration process applicable at the wafer scale that offers relaxed alignment and mode mismatch tolerance. We present the first demonstration of a complete laser-PIC package operating in a single mode, with integrated output fiber and thermal tuning of similar to 1nm.

引用

页码：1387 / 1391

页数：5

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