Fault localization of Cold-temperature Scan failures by integrating Soft Defect Localization and Electro-Optical Probing

被引：0

作者：

Jamil, Imran Arif Abdul ^{[1
]}

Sheng, Foo Loke ^{[1
]}

Pawet, Alwi ^{[1
]}

Jie, Chew Jun ^{[1
]}

Liang, Siow Cheng ^{[1
]}

Hui, Tan Hui ^{[1
]}

Sum, Benjamin Lo Yuen ^{[2
]}

机构：

[1] NXP Semicond Sdn Bhd, Failure Anal Lab, Sungai Way Free Trade Ind Zone, Petaling Jaya 47300, Malaysia

[2] Taiwan NXP Semicond Co Ltd, Failure Anal Lab, 10 Jingwu Rd, Kaohsiung 811, Taiwan

来源：

2024 IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS, IPFA 2024 | 2024年

关键词：

Scan; Soft Defect Localization (SDL); Cold; fault isolation; Electro-Optical Probing (EOP);

D O I：

10.1109/IPFA61654.2024.10691051

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Scan testing has been the main method for testing in the semiconductor industry due to its extremely high test coverage and high reliability in determining the suspected region of failure. Scan test failures typically fail solidly across voltage, frequency, and temperature. However, there are scan failures that would only fail at cold temperatures and are classified as temperature-dependent scan failures. Electro-Optical Probing (EOP) analysis is usually performed when the part fails to observe abnormal transistor switching activity. However, The main challenge behind cold temperature scan failures is the inability to perform EOP at very cold temperatures mainly due to tool limitations with conventional tool setup. This paper will further discuss a new approach by performing EOP at room temperature on three different types of scan failures (Stuck-at, Time-delay, and Chain) that would still yield tangible fault isolation results by referencing the Soft Defect Localization (SDL) hotspot performed at cold temperature.

引用

页数：8

共 4 条

[1] Low Temperature Fault Isolation Using Soft Defect Localization
Staller, Kristopher D.
ISTFA 2012: CONFERENCE PROCEEDINGS FROM THE 38TH INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 2012, : 596 - 600
[2] Application of Electro Optical Terahertz Pulse Reflectometry for Fault Localization and Defect Analysis
Lin, Yi-Sheng
Hsiao, Yu-Hsiang
Lee, Shu-Hua
ISTFA 2017: CONFERENCE PROCEEDINGS FROM THE 43RD INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 2017, : 25 - 35
[3] Integrating NI LabVIEW in Soft Defect Localization of Temperature Dependent Voltage Failure
Llamera, Paul Hubert P.
Garcia-Awitan, Camille Joyce G.
Cruz, Febus Reidj
Magwili, Glenn
2019 IEEE 26TH INTERNATIONAL SYMPOSIUM ON PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2019,
[4] Room temperature defect localization of hot and cold failures using scanning probe microscopy techniques
Tarun, AB
Concepcion, P
Bailon, MF
Arboleda, JP
Miranda, J
Descallar, W
So, MS
IPFA 2005: Proceedings of the 12th International Symposium on the Physical & Failure Analysis of Integrated Circuits, 2005, : 5 - 8

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