Low Temperature Fault Isolation Using Soft Defect Localization

被引：0
|
作者：
Staller, Kristopher D. [1 ]
机构：
[1] Texas Instruments Inc, Tucson, AZ USA
来源：
ISTFA 2012: CONFERENCE PROCEEDINGS FROM THE 38TH INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS | 2012年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Cold temperature failures are often difficult to resolve, especially those at extreme low levels (< -40 degrees C). Momentary application of chill spray can confirm the failure mode, but is impractical during photoemission microscopy (PEM), laser scanning microscopy (LSM), and multiple point microprobing. This paper will examine relatively low-cost cold temperature systems that can hold samples at steady state extreme low temperatures and describe a case study where a cold temperature stage was combined with LSM soft defect localization (SDL) to rapidly identify the cause of a complex cold temperature failure mechanism.
引用
收藏
页码：596 / 600
页数：5
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