AlGaN/GaN Dual-Gate HEMT Using a High Al Mole Fraction and Thin Barrier Layer

被引:0
|
作者
Ando, Yuji [1 ]
Takahashi, Hidemasa [1 ]
Makisako, Ryutaro [1 ]
Wakejima, Akio [2 ]
Suda, Jun [1 ]
机构
[1] Nagoya Univ, Dept Elect, Chikusa ku, Nagoya, Japan
[2] Kumamoto Univ, Res & Educ Inst Semicond & Informat, Chuo Ku, Kumamoto, Japan
关键词
III-V semiconductors; high electron mobility transistors; microwave field-effect transistors; FIELD-EFFECT TRANSISTORS;
D O I
10.1049/ell2.70194
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article examines the use of a high Al mole fraction (x = 0.34) and a thin barrier layer (t = 11.5 nm) in AlGaN/GaN high electron mobility transistors (HEMTs) with both single-gate and dual-gate configurations. Single-gate HEMTs with the current epitaxial structure demonstrated an improved maximum drain current and transconductance, as well as reduced current collapse, compared to similar devices with the reference structure (x = 0.22 and t = 17.5 nm). Furthermore, a dual-gate HEMT with the current epitaxial structure and a gate length of 80 nm showed an extrapolated unity current gain cut-off frequency of 74 GHz and an extrapolated maximum oscillation frequency of 248 GHz, whereas a similar device using the reference structure exhibited values of 63 and 231 GHz, respectively.
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页数:5
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