Transient Liquid-Phase Bonding Using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging

被引：0

作者：

Lee, Dong-Bok ^{[1
]}

Seo, Young-Jin ^{[1
]}

Yoon, Jeong-Won ^{[1
]}

机构：

[1] Chungbuk Natl Univ, Dept Adv Mat Engn, 1 Chungdae Ro, Cheongju 28644, Chungbuk, South Korea

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2025年 / 54卷 / 03期

基金：

新加坡国家研究基金会;

关键词：

Intermetallic compounds; soldering; electronic packaging; thermo-compression bonding; microstructure; laminated metal preform; SOLDER; MICROSTRUCTURE; EVOLUTION;

D O I：

10.1007/s11664-025-11738-5

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Intermetallic compound (IMC) joints formed via transient liquid-phase (TLP) bonding offer excellent high-temperature durability. However, IMC formation at the joint requires long bonding times and high pressures. In this study, to reduce the bonding time and pressure required for IMC formation, a Sn/Ni/Sn laminated metal preform was fabricated by inserting Ni foil between Sn foils, and this material was used to bond a chip to a substrate. The microstructure of the joint cross-section was analyzed using field-emission scanning electron microscopy and energy-dispersive x-ray spectroscopy. The Sn foil was completely converted to 7 mu m Ni3Sn4 within 15 min, forming a stable TLP-bonded joint. After bonding, a shear test was conducted to evaluate the mechanical properties of the joints, which revealed high shear strength, exceeding 46 MPa.

引用

页码：1592 / 1601

页数：10

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