A comprehensive review of air-cooled heat sinks for thermal management of electronic devices

被引：0
|
作者：
Nair, Vipin [1 ]
Baby, Anjana [1 ]
M.B., Anoop [1 ]
S., Indrajith [1 ]
Murali, Midhun [1 ]
Nair, Meenakshi B. [1 ]
机构：
[1] Department of Mechanical Engineering, Carmel College of Engineering and Technology, Kerala, Alappuzha,688004, India
来源：
International Communications in Heat and Mass Transfer | 2024年 / 159卷
关键词：
Compendex;
D O I：
10.1016/j.icheatmasstransfer.2024.108055
中图分类号：
学科分类号：
摘要：
Fins (heat exchange)
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