EVALUATION OF AIR-COOLED MICROCHANNEL HEAT SINKS

被引：0
|
作者：
SCHULENBURG, N
KVAMME, E
NELSON, A
ROH, J
PHILLIPS, JR
MANSINGH, V
BLACKMAN, J
机构：
来源：
PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2 | 1989年
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：913 / 924
页数：12
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