A comprehensive review of air-cooled heat sinks for thermal management of electronic devices

被引：0
|
作者：
Nair, Vipin [1 ]
Baby, Anjana [1 ]
M.B., Anoop [1 ]
S., Indrajith [1 ]
Murali, Midhun [1 ]
Nair, Meenakshi B. [1 ]
机构：
[1] Department of Mechanical Engineering, Carmel College of Engineering and Technology, Kerala, Alappuzha,688004, India
来源：
International Communications in Heat and Mass Transfer | 2024年 / 159卷
关键词：
Compendex;
D O I：
10.1016/j.icheatmasstransfer.2024.108055
中图分类号：
学科分类号：
摘要：
Fins (heat exchange)
引用
收藏
相关论文
共 50 条
  • [21] Integrated thermal analysis of indirect air-cooled electronic chassis
    Tang, L
    Joshi, YK
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1997, 20 (02): : 103 - 110
  • [22] Air-cooled micro-porous heat exchangers for thermal management of fuel cells
    Boyd, Ben
    Hooman, Kamel
    INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2012, 39 (03) : 363 - 367
  • [23] Integrated thermal analysis of indirect air-cooled electronic chassis
    Tang, L
    Joshi, Y
    INTERSOCIETY CONFERENCE ON THERMAL PHENOMENA IN ELECTRONIC SYSTEMS - I-THERM V, 1996, : 217 - 225
  • [24] The Role of Anodization in Naturally Cooled Heat Sinks for Power Electronic Devices
    Zhang, Zhongchen
    Collins, Michael
    Lau, Eric
    Botting, Chris
    Bahrami, Majid
    JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2020, 142 (05):
  • [25] Investigation of 3D manifold architecture heat sinks in air-cooled condensers
    Kharangate, Chirag R.
    Libeer, Will
    Palko, James
    Lee, Hyoungsoon
    Shi, Jessica
    Asheghi, Mehdi
    Goodson, Kenneth E.
    APPLIED THERMAL ENGINEERING, 2020, 167
  • [26] Thermal Conductivity of External Contaminants of Air-Cooled Heat Exchangers
    Kuntysh V.B.
    Dudarev V.V.
    Filatov S.O.
    Korol’kova A.M.
    Chemical and Petroleum Engineering, 2017, 53 (3-4) : 244 - 247
  • [27] Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling
    Nabi, Aharon
    Rodgers, Peter
    Bar-Cohen, Avram
    TWENTY SECOND ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2006, 2006, : 2 - +
  • [28] Development of Synthetic Jet Arrays for Heat Transfer Enhancement in Air-Cooled Heat Sinks for Electronics Cooling
    Zhang, Min
    Yeom, Taiho
    Yu, Youmin
    Huang, Longzhong
    Simon, Terrence W.
    North, Mark T.
    Cui, Tianhong
    PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE, 2012, VOL 2, 2012, : 601 - 606
  • [29] HEAT TRANSFER ENHANCEMENT BY SYNTHETIC JET ARRAYS IN AIR-COOLED HEAT SINKS FOR USE IN ELECTRONICS COOLING
    Huang, Longzhong
    Simon, Terrence
    Zhang, Min
    Yu, Youmin
    North, Mark
    Cui, Tianhong
    PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE, 2012, VOL 2, 2012, : 659 - 666
  • [30] Establishing Thermal Air-cooled Limit for High Performance Electronics Devices
    Refai-Ahmed, Gamal
    Do, Hoa
    Hadad, Yaser
    Rangarajan, Srikanth
    Sammakia, Bahgat G.
    Gektin, Vadim
    Cader, Tahir
    2020 IEEE 22ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2020, : 347 - 354
12345