Low-Temperature and Low-Pressure Fine-Pitch Micro Cu Bump Bonding Using Stress Migration of a Sputtering Ag Layer

被引：0
|
作者：
Zhang, Zheng [1 ]
Suetake, Aiji [1 ]
Liu, Ran [1 ]
Yoshida, Hiroshi [1 ]
Okumura, Rieko [1 ]
Chen, Chuantong [1 ]
Suganuma, Katsuaki [1 ]
机构：
[1] Institute Of Scientific And Industrial Research (SANKEN), Osaka University, Osaka,567-0047, Japan
来源：
2024 International Conference on Electronics Packaging, ICEP 2024 | 2024年
关键词：
Compendex;
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学科分类号：
摘要：
Chemical bonds - Grain growth - Integrated circuit interconnects - Sputtering - Temperature
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页码：311 / 312
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