Investigation of bonding properties of solderable anisotropic polymer composite filled with low- and high-melting-point alloy fillers

被引：0
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作者：
School of Mechanical Engineering, Chung-Ang University, Seoul [1 ]
156-756, Korea, Republic of
不详 [2 ]
25913, Korea, Republic of
机构：
来源：
J Mater Sci Mater Electron | / 32卷
基金：
新加坡国家研究基金会;
关键词：
Alloy mixing - Anisotropic polymers - Bonding property - Composite joint - Conduction paths - High melting point - Low melting point alloy - Low-high - Mixing proportions - Polymer composite;
D O I：
2052
中图分类号：
学科分类号：
摘要：
26
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