Investigation of bonding properties of solderable anisotropic polymer composite filled with low- and high-melting-point alloy fillers

被引：0
|
作者：
School of Mechanical Engineering, Chung-Ang University, Seoul [1 ]
156-756, Korea, Republic of
不详 [2 ]
25913, Korea, Republic of
机构：
来源：
J Mater Sci Mater Electron | / 32卷
基金：
新加坡国家研究基金会;
关键词：
Alloy mixing - Anisotropic polymers - Bonding property - Composite joint - Conduction paths - High melting point - Low melting point alloy - Low-high - Mixing proportions - Polymer composite;
D O I：
2052
中图分类号：
学科分类号：
摘要：
26
引用
收藏
相关论文
共 39 条
  • [21] An investigation of the bonding properties of Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs)
    Youn, Hee Jun
    Lee, Jeong Il
    Ha, Min Jeong
    Kim, Jong-Min
    Yim, Byung-Seung
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 34 (10)
  • [22] Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers
    Yim, Byung-Seung
    Oh, Seung Hoon
    Jeong, Jin Sik
    Kim, Jong-Min
    JOURNAL OF COMPOSITE MATERIALS, 2013, 47 (09) : 1141 - 1152
  • [23] Electrical properties of polymer/low-melting-point alloy binary systems
    Yi, XS
    Zhang, XW
    Shen, L
    Pan, Y
    POLYMER-PLASTICS TECHNOLOGY AND ENGINEERING, 2000, 39 (05) : 829 - 833
  • [24] Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers
    Yim, Byung-Seung
    Kim, Jong-Min
    MATERIALS TRANSACTIONS, 2010, 51 (12) : 2329 - 2331
  • [25] Low melting point alloy modified polymer composite with sharp stiffness switch for soft actuator
    Liu, Yahao
    Wang, Yuansheng
    Yang, Xue
    Zheng, Jian
    Huang, Wei
    Zhang, Yu
    Zhang, Xiao
    Wang, Xuan
    POLYMER, 2023, 282
  • [26] Novel method of polymer/low-melting-point metal alloy/light metal fiber composite fabrication
    Park, J.
    Shin, K. S.
    EXPRESS POLYMER LETTERS, 2016, 10 (07): : 526 - 536
  • [27] Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
    Lee, Jin Woon
    Lee, Seong Hyuk
    Kim, Jong-Min
    Kim, Jae Hyung
    Lee, Jung Hee
    MATERIALS TRANSACTIONS, 2008, 49 (11) : 2572 - 2578
  • [28] Development of low environmental load silica/low melting point alloy composite process and evaluation of solidified material properties
    Masuda K.
    Razavi-Khosroshahi H.
    Fuji M.
    Fuji, Masayoshi (fuji@nitech.ac.jp), 1600, Journal of the Japan Society of Powder and Powder Metallurgy, 15 Morimoto-cho Shimogamo, Sakyo-Ku Kyoto, Japan (67): : 343 - 348
  • [29] A novel low-melting-point alloy-loaded polymer composite. I. Effect of processing temperature on the electrical properties and morphology
    Zhang, XW
    Pan, Y
    Shen, L
    Zheng, Q
    Yi, XS
    JOURNAL OF APPLIED POLYMER SCIENCE, 2000, 77 (05) : 1044 - 1050
  • [30] Dynamic Response and Deformative Mechanism of the Shape Memory Polymer Filled with Low-Melting-Point Alloy under Different Dynamic Loads
    Wang, Huanhuan
    Zhang, Yongqiang
    Tan, Zhuhua
    POLYMERS, 2023, 15 (02)
1234