Reworking multichip modules

被引：0
|
作者：
Agroskin, S. [1 ]
Geiger Jr., D. [1 ]
Griswold, B. [1 ]
Min, B.Y. [1 ]
Reinschmidt, R. [1 ]
Lasiter, J. [1 ]
Mathews, P.B. [1 ]
Chong, F.C. [1 ]
机构：
[1] MicroModule Systems Inc, Cupertino, United States
来源：
Electronic Packaging and Production | 1995年 / 35卷 / 03期
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页码：42 / 45
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