Reworking multichip modules

被引：0

作者：

Agroskin, S. ^{[1
]}

Geiger Jr., D. ^{[1
]}

Griswold, B. ^{[1
]}

Min, B.Y. ^{[1
]}

Reinschmidt, R. ^{[1
]}

Lasiter, J. ^{[1
]}

Mathews, P.B. ^{[1
]}

Chong, F.C. ^{[1
]}

机构：

[1] MicroModule Systems Inc, Cupertino, United States

来源：

Electronic Packaging and Production | 1995年 / 35卷 / 03期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：42 / 45

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