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- [41] A UNIQUE LOW-COST PIN GRID ARRAY PACKAGE WITH HEATSPREADER PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2, 1989, : 199 - 207
- [42] Development of low-cost and highly reliable wafer process package 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 40 - 46
- [44] Low-cost, Compact and Robust Gas Abundance Sensor Package SENSORS AND SYSTEMS FOR SPACE APPLICATIONS XI, 2018, 10641
- [45] FOStrip Technique for Low-Cost Fan-Out Package 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
- [46] Low-cost polymer infrared imaging lens INFRARED TECHNOLOLGY AND APPLICATIONS XXIX, 2003, 5074 : 855 - 866
- [47] Fabrication of low-cost polymer microlens array 2ND INTERNATIONAL CONFERENCE ON ADVANCED OPTICAL MANUFACTURING AND TESTING TECHNOLOGIES: ADVANCED OPTICAL MANUFACTURING TECHNOLOGIES, 2006, 6149
- [50] Chip Scale Package with Low Cost Substrate Evaluation and Characterization 2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2014, : 421 - 425