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- [5] Microwave Induced Plasma Decapsulation of Stressed and Delaminated High Pin-count Copper Wire Bonded IC Packages 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1717 - 1723
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- [9] Pin-count reduction for continuous flow microfluidic biochips MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (01): : 483 - 494
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