New die attach adhesives that stick

The concept of an ideal modulus die attach adhesive and the development of an adhesive to meet the conflicting requirements for bonding small and large die were discussed. High modulus die attach adhesives were used to assemble the majority of small to medium size dies. To resolve the problem of warpage related delamination with large dies, low-stress die attach materials were used. These epoxy die attach materials had a very low modulus to help absorb the stress and, a very low modulus at wire bonding temperatures.