Design of reliance die attach

被引：0
|
作者：
Hu, J.M. [1 ]
Pecht, M. [1 ]
Dasgupta, A. [1 ]
机构：
[1] Univ of Maryland, College Park, United States
来源：
International Journal of Microcircuits and Electronic Packaging | 1993年 / 16卷 / 01期
关键词：
81;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
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页码：1 / 21
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