Millimeter-wave characteristics of flip-chip interconnects for multichip modules

被引：0
|
作者：
Heinrich, Wolfgang [1 ]
Jentzsch, Andrea [1 ]
Baumann, Guido [1 ]
机构：
[1] Ferdinand-Braun-Inst fuer, Hoechstfrequenztechnik, Berlin, Germany
来源：
IEEE Transactions on Microwave Theory and Techniques | 1998年 / 46卷 / 12 pt 2期
关键词：
Number:; -; Acronym:; BMBWF; Sponsor: Bundesministerium für Bildung; Wissenschaft; Forschung und Technologie; 01; BM; 601; BMBF; Sponsor: Bundesministerium für Bildung und Forschung;
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摘要：
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页码：2264 / 2268
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