Millimeter-wave characteristics of flip-chip interconnects for multichip modules

被引：0

作者：

Heinrich, Wolfgang ^{[1
]}

Jentzsch, Andrea ^{[1
]}

Baumann, Guido ^{[1
]}

机构：

[1] Ferdinand-Braun-Inst fuer, Hoechstfrequenztechnik, Berlin, Germany

来源：

IEEE Transactions on Microwave Theory and Techniques | 1998年 / 46卷 / 12 pt 2期

关键词：

Number:; -; Acronym:; BMBWF; Sponsor: Bundesministerium fÃ¼r Bildung; Wissenschaft; Forschung und Technologie; 01; BM; 601; BMBF; Sponsor: Bundesministerium fÃ¼r Bildung und Forschung;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：2264 / 2268

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