DEVELOPMENTS IN ADDITIVE CIRCUITRY USING POLYMER THICK FILM MATERIALS.

被引：0
|
作者：
Schueler, Steve D.
Green, William J.
机构：
来源：
Electri-onics | 1984年 / 30卷 / 04期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：17 / 21
相关论文
共 50 条
  • [41] Radiation Utilization of Solid Polymer Scrap Materials.
    Rosiak, Janusz
    Perkowski, Jan
    Pekala, Wladyslaw
    Polimery/Polymers, 1984, 29 (03) : 91 - 95
  • [42] Biomolecular approach to polymer encapsulation in mesoporous materials.
    Ford, CD
    Liu, LM
    Singh, M
    He, JB
    John, VT
    McPherson, G
    Sennett, M
    Bose, A
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2003, 225 : U664 - U664
  • [43] Materials forum - Thick film measurement
    不详
    ADVANCED MATERIALS, 1999, 11 (05) : 362 - 362
  • [44] DIELECTRIC MATERIALS FOR THICK FILM CAPACITORS
    SMYLY, JP
    AMERICAN CERAMIC SOCIETY BULLETIN, 1969, 48 (04): : 428 - &
  • [45] TRENDS IN THICK-FILM MATERIALS
    MONES, AH
    ROSENBERG, RM
    SOLID STATE TECHNOLOGY, 1976, 19 (10) : 47 - 49
  • [46] THICK-FILM MATERIALS AND RELIABILITY
    GRAVES, PW
    ELECTRICAL COMMUNICATION, 1982, 57 (02): : 127 - 131
  • [47] THICK-FILM MATERIALS FOR HYBRIDS
    COLEMAN, M
    RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
  • [48] Hydrogen separation using ternary polymer blend compared with the inorganic zeolite materials.
    Sharma, KR
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1999, 218 : U635 - U636
  • [49] Processing of photoimageable thick film materials
    Wood, J
    Sabo, C
    London, A
    Barnwell, P
    1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1998, 3582 : 783 - 788
  • [50] RECENT DEVELOPMENTS IN THICK-FILM HYBRID MODULES
    MELAN, EH
    SEMICONDUCTOR PRODUCTS AND SOLID STATE TECHNOLOGY, 1967, 10 (06): : 23 - &
12345