Substrate-independent wafer transfer technique for surface-micromachined devices

被引：0
|
作者：
Nguyen, H. [1 ]
Patterson, P. [1 ]
Toshiyoshi, H. [1 ]
Wu, M.C. [1 ]
机构：
[1] Univ of California at Los Angeles, Los Angeles, United States
来源：
Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) | 2000年
关键词：
Wafer transfer techniques;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
We report on a new wafer transfer technique that can remove and transfer surface-micromachined layers to application-specific substrates. This process, however, is not limited to only MEMS devices and can be applicable to other semiconductor devices. Successful transfer of a 1 cm×1 cm MEMS chip with electrostatically actuated curled cantilever switches to a transparent quartz substrate has been demonstrated. Pull-in voltage for transferred devices is 31 V compared with 23 V for devices on standard silicon substrates.
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页码：628 / 632
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