Substrate-independent wafer transfer technique for surface-micromachined devices

被引:0
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作者
Nguyen, H. [1 ]
Patterson, P. [1 ]
Toshiyoshi, H. [1 ]
Wu, M.C. [1 ]
机构
[1] Univ of California at Los Angeles, Los Angeles, United States
关键词
Wafer transfer techniques;
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摘要
We report on a new wafer transfer technique that can remove and transfer surface-micromachined layers to application-specific substrates. This process, however, is not limited to only MEMS devices and can be applicable to other semiconductor devices. Successful transfer of a 1 cm×1 cm MEMS chip with electrostatically actuated curled cantilever switches to a transparent quartz substrate has been demonstrated. Pull-in voltage for transferred devices is 31 V compared with 23 V for devices on standard silicon substrates.
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页码:628 / 632
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