DYNAMIC REAL TIME 3-D MEASUREMENT TECHNIQUE FOR IC INSPECTION.

被引：4
|
作者：
Breton, B.C. [1 ]
Thong, J.T.L. [1 ]
Nixon, W.C. [1 ]
机构：
[1] Cambridge Univ, Cambridge, Engl, Cambridge Univ, Cambridge, Engl
来源：
Microelectronic Engineering | 1986年 / 5卷 / 1-4期
关键词：
MICROSCOPES; ELECTRON; -; Applications;
D O I：
10.1016/0167-9317(86)90088-2
中图分类号：
学科分类号：
摘要：
Stereoscopic imaging in the SEM enhances the ability to resolve topographical ambiguities encountered during IC process inspection. The limitations of previous implementations are examined and have been addressed during the development of a stereo system. Results are also presented for in situ height measurements within the instrument.
引用
收藏
页码：541 / 545
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