Effect of surface-active substances on electrodeposition of copper in narrow cylindrical holes

被引：0
|
作者：
Braun, E.V. [1 ]
Yarlykov, M.M. [1 ]
Kruglikov, S.S. [1 ]
Savel'ev, M.I. [1 ]
机构：
[1] D. I. Mendeleev Inst of Chemical, Technology, Moscow, Russia
来源：
Protection of Metals (English translation of Zaschita Metallov) | 1991年 / 26卷 / 03期
关键词：
Copper and Alloys;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：382 / 383
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