Effect of surface-active substances on electrodeposition of copper in narrow cylindrical holes

被引：0

作者：

Braun, E.V. ^{[1
]}

Yarlykov, M.M. ^{[1
]}

Kruglikov, S.S. ^{[1
]}

Savel'ev, M.I. ^{[1
]}

机构：

[1] D. I. Mendeleev Inst of Chemical, Technology, Moscow, Russia

来源：

Protection of Metals (English translation of Zaschita Metallov) | 1991年 / 26卷 / 03期

关键词：

Copper and Alloys;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：382 / 383

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