New lead-free processes require industry collaboration

被引：0
|
作者：
Grano, Frank [1 ]
机构：
[1] Sanmina-SCI, 13000 South Memorial Parkway, Huntsville, AL 35807
来源：
Advanced Packaging | 2004年 / 13卷 / 06期
关键词：
Lead-free assembly processes - Restriction on Hazardous Substances (RoHS) directives - Wave solders;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
(Edited Abstract)
引用
收藏
相关论文
共 50 条
  • [21] 3-D chip scale with lead-free processes
    Wimer, J. Jay
    Semiconductor International, 2003, 26 (11)
  • [22] Interfacial reaction of lead-free solders with lead-free finished leadframes
    Wong, Y. W.
    Wu, C. M. L.
    Woo, H. C. B.
    Choi, Y. T.
    Li, K. L.
    2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, : 412 - 417
  • [23] Lead-free Flux Effect in Lead-free Solder Joint Improvement
    Leng, Eu Poh
    Ding, Min
    Ahmad, Ibrahim
    Jiun, Hoh Huey
    Hazlinda, Kamarudin
    IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 541 - 548
  • [24] Lead-free solder
    Black, H
    CHEMISTRY & INDUSTRY, 2005, (21) : 22 - 23
  • [25] Lead-free alloys
    Miric, Anton Zoran
    Grusd, Angela
    Soldering and Surface Mount Technology, 1998, 10 (01): : 19 - 25
  • [26] Lead-free: Ready or not
    Flower, Gail
    SMT Surface Mount Technology Magazine, 2005, 19 (02):
  • [27] LEAD-FREE in LOUISVILLE
    Smith, Kelley Dearing
    Tegene, Daniel
    Aaron, Denise
    Fritz, Emily
    CIVIL ENGINEERING, 2020, 90 (12): : 68 - 73
  • [28] Lead-free alloys
    Miric, AZ
    Grusd, A
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 1998, 10 (01) : 19 - +
  • [29] lead-free soldering
    Steffner, KJ
    KUNSTSTOFFE-PLAST EUROPE, 2005, 95 (09): : 195 - 198
  • [30] Lead-free alchemy
    Courtemanche, Meredith
    SMT Surface Mount Technology Magazine, 2007, 21 (09):
12345