Evaluation of TiW + Al/Cu electromigration performance

被引：0
|
作者：
Armstrong, N.P. [1 ]
机构：
[1] GEC-Plessey Research, Caswell, United Kingdom
来源：
Quality and Reliability Engineering International | 1991年 / 7卷 / 04期
关键词：
Semiconductor Materials;
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摘要：
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页码：281 / 286
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