Model for electromigration failure distributions of contacts and vias in advanced IC technologies

被引：0
|
作者：
Lucent Technologies, Orlando, United States [1 ]
机构：
来源：
Int Conf Solid State Integr Circuit Technol Proc | / 234-237期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
12
引用
收藏
相关论文
共 50 条
  • [41] A model regarding electrical contacts in advanced degradation
    Aronis, CG
    Psomopoulos, CP
    Karagiannopoulos, CG
    Bourkas, PD
    PROCEEDINGS OF THE IASTED INTERNATIONAL CONFERENCE ON APPLIED SIMULATION AND MODELLING, 2004, : 23 - 28
  • [42] A Novel Circuit Model for Multiple Through Silicon Vias (TSVs) in 3D IC
    Yi, Yang
    Zhou, Yaping
    2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2013,
  • [43] An analysis of the weakest-link model for early electromigration failure
    Dwyer, VM
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2004, 37 (14) : 2035 - 2046
  • [44] CONTACT ELECTROMIGRATION INDUCED LEAKAGE FAILURE IN AL/N+SI AND P+SI CONTACTS
    CHERN, J
    OLDHAM, WG
    CHEUNG, N
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1984, 131 (08) : C325 - C325
  • [45] Electromigration failure distributions for multi-layer interconnects as a function of line width: Experiments and simulation
    Brown, DD
    Sanchez, JE
    Pham, V
    Besser, PR
    Korhonen, MA
    Li, CY
    ADVANCED METALLIZATION FOR FUTURE ULSI, 1996, 427 : 107 - 112
  • [46] Reliability-driven layout decompaction for electromigration failure avoidance in complex mixed-signal IC designs
    Jerke, G
    Lienig, J
    Scheible, J
    41ST DESIGN AUTOMATION CONFERENCE, PROCEEDINGS 2004, 2004, : 181 - 184
  • [47] AN ELECTROMIGRATION FAILURE MODEL FOR INTERCONNECTS UNDER PULSED AND BIDIRECTIONAL CURRENT STRESSING
    TAO, J
    CHEUNG, NW
    HU, CM
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1994, 41 (04) : 539 - 545
  • [48] DYNAMIC FUSE MODEL FOR ELECTROMIGRATION FAILURE OF POLYCRYSTALLINE METAL-FILMS
    BRADLEY, RM
    WU, K
    PHYSICAL REVIEW E, 1994, 50 (02): : R631 - R634
  • [49] Electromigration Failure Time Model of General Circuit-Like Interconnects
    Lin, Ming-Hsien
    Oates, Tony
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017, 17 (02) : 381 - 398
  • [50] Advanced Bayesian Estimation of Weibull Early Life Failure Distributions
    Kurz, Daniel
    Lewitschnig, Horst
    Pilz, Juergen
    QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL, 2014, 30 (03) : 363 - 373
12345